OLED packaging method

ABSTRACT

An OLED packaging method is provided, in which a first outer bound confinement layer is first formed and then, a first organic layer is formed on the first inorganic layer in an area enclosed by the first outer bound confinement layer so that facilities for forming the first organic layer can be diversified and an organic material used to form the first organic layer is not subjected to constraint in respect of viscosity thereof, whereby using an organic material with a reduced viscosity allows for better homogeneity of the first organic layer, the thickness reduced, and thus helping reduce a curving radius of the OLED package structure to realize rollable displaying with a reduced curving radius. Further, the first outer bound confinement layer helps block external moisture and oxygen from corroding the first organic layer in a sideway direction.

CROSS REFERENCE TO RELATED APPLICATIONS

This is a divisional application of co-pending patent application Ser.No. 15/505,116, filed on Feb. 20, 2017, which is a national stage of PCTApplication Number PCT/CN2016/113037, filed on Dec. 29, 2016, claimingforeign priority of Chinese Patent Application Number 201611163660.7,filed on Dec. 15, 2016.

BACKGROUND OF THE INVENTION 1. Field of the Invention

The present invention relates to the field of display technology, andmore particular to an OLED packaging method and an OLED packagestructure.

2. The Related Arts

Organic light-emitting display (OLED) possesses various advantages, suchas being self-luminous, low drive voltage, high luminous efficiency,short response time, high clarity and contrast, almost 180° view angle,wide range of operation temperature, and easy realization of flexibledisplaying and large-area full-color displaying, and is considered themost promising display device in the industry.

Based on the way of driving, OLEDs can be classified in two categories,passive matrix OLED (PMOLED) and active matrix OLED (AMOLED), namely twocategories of direct addressing and TFT array addressing, among whichthe AMOLED comprises pixels that are arranged in an array and belongs toan active display type, having high light emission performance and beingcommonly used in high definition large-sized display devices.

An OLED device is generally made up of a substrate, an anode arranged onthe substrate, a hole injection layer arranged on and anode, a holetransport layer arranged on the hole injection layer, an emissive layerarranged on the hole transport layer, an electron transport layerarranged on the emissive layer, an electron injection layer arranged onthe electron transport layer, and a cathode arranged on the electroninjection layer. The principle of light emission of the OLED device isthat when a semiconductor material and an organic light emissionmaterial are driven by an electric field, carrier currents are injectedand re-combine to cause emission of light. Specifically, the OLED deviceoften uses an indium tin oxide (ITO) electrode and a metal electrode torespectively serve as anode and cathode of the device and electrons andholes, when driven by a predetermined electrical voltage, arerespectively injected into the electron transport layer and the holetransport layer from the cathode and the anode such that the electronsand the holes respectively migrate through the electron transport layerand the hole transport layer to get into the emissive layer and meet inthe emissive layer to form excitons to excite light emissive moleculesto emit light, the later undergoing radiation relaxation to give offvisible light.

OLED based flat panel displaying and lighting fields recently attractwide attention of the scientific research and academic community.Particularly, in the recent years, flexible OLED display panels thatexhibit wide future prosperity are now emerging and become the focus ofcompetition among the major panel manufacturers. The flexible OLEDdisplay device may readily generate cracking during a curving or foldingprocess so as to introduce external moisture and oxygen therein therebydegrading organic light emitting materials and reducing the service lifeof the OLED devices. Currently, the most widely used flexible thin filmencapsulation (TFE) generally involves an inorganic layer/organiclayer/inorganic layer alternating structure, wherein the inorganiclayers function to block moisture and oxygen, while the organic layerfunctions to release stresses. A rollable OLED display device, as anultimate goal, imposes more strict requirements for thin filmencapsulation structure, for the smaller the curving radius, the moreeasily it is possible to realize rollable displaying.

Currently, in the inorganic layer/organic layer/inorganic layeralternating flexible thin film package structure, coating of the organiclayer often adopts an ink jet printing (IJP) method that exhibits betterprecision and higher efficiency. An worldwide famous UP manufacturer,Kateeva, discloses, in US Patent Application Serial No. 2014/0233843, anIJP pixel printing technique, in which during ink jetting, a bank thatis higher than a thickness of the printing material inside the pixelarea must be formed outside the pixel area to suppress spreading of thejetted printing liquid. However, the formation of the bank increases anoperation step in manufacturing a substrate and often lacks thecapability of blocking external moisture and oxygen.

Seoul National University of Korea discloses, in US Patent ApplicationSerial No. 2015/0042346, an OLED package structure, in which thethin-film encapsulation structure adopts multiple inorganiclayer/organic layer alternating structure, wherein coating of theorganic layer is achieved with flash evaporation, ink jet printing, orslot die coating. However, the patent document lacks details concerningthickness of coating, viscosity of monomers of organic materials, andmanufacturing processes. If the coating of the organic layer isconducted with flash evaporation, ink jet printing, or slot die coating,then it is quite doubtful concerning the feasibility of forming a thinfilm encapsulation structure that has a homogeneous thickness and isrollable.

SUMMARY OF THE INVENTION

Objectives of the present invention are to provide an OLED packagingmethod, which helps reduce curving radius of an OLED package structure,realizes rollable displaying having a reduced curving radius, and alsoprovides an OLED package structure so formed having a more powerfulmoisture and oxygen blocking capability and an extended service life.

Objectives of the present invention are also to provide an OLED packagestructure, which can realize rollable displaying having a reducedcurving radius, and also have a more powerful moisture and oxygenblocking capability and an extended service life.

To achieve the above objectives, the present invention provides an OLEDpackaging method, which comprises the following steps:

Step 1: providing a OLED device and forming a first inorganic layer onthe OLED device such that the first inorganic layer covers the OLEDdevice;

Step 2: forming an organic photoresist layer on the first inorganiclayer;

Step 3: subjecting the organic photoresist layer to exposure anddevelopment such that a developed and removed portion of the organicphotoresist layer defines an outer bound confinement area on the firstinorganic layer;

Step 4: depositing a dense material layer on the organic photoresistlayer and the outer bound confinement area of the first inorganic layer,such that the dense material layer has a thickness less than a thicknessof the organic photoresist layer to form a substrate-to-be-peeled-off;

Step 5: dipping the substrate-to-be-peeled-off, in the entirety thereof,in a photoresist peeling solution so as to remove the organicphotoresist layer and at the same time peel off a portion of the densematerial layer that is located on the organic photoresist layer incombination with the organic photoresist layer, while preserving aportion of the dense material layer that is located on the outer boundconfinement area of the first inorganic layer to form a first outerbound confinement layer;

Step 6: coating an organic material on an area of the first inorganiclayer that is enclosed by the first outer bound confinement layer suchthat the organic material so coated has a thickness less than athickness of the first outer bound confinement layer so as to form afirst organic layer; and

Step 7: forming a second inorganic layer on the first organic layer andthe first outer bound confinement layer.

In Step 4, plasma enhanced chemical vapor deposition, atomic layerdeposition, pulsed laser deposition, sputtering, or vapor deposition isapplied to deposit the dense material layer; the dense material layer isformed of a material comprising one or multiple ones of diamond-likecarbon, zirconium aluminate, graphene, silver, aluminum, aluminumnitride, and copper; and the dense material layer has a thickness of 0.5μm-3 μm.

In Step 6, spin coating, screen printing, slot spin coating, dispensing,or ink jet printing is applied to form the first organic layer; thefirst organic layer is formed of a material comprising one or multipleones of acrylic, hexamethyldisiloxane, polyacrylate, polycarbonate, andpolystyrene; and the first organic layer has a thickness of 0.5 μm-3 μm.

Optionally, the OLED packaging method further comprises Step 8: forminga plurality of package units on the second inorganic layer in a stackedmanner such that the package units each comprise an second outer boundconfinement layer, a second organic layer arranged inside the secondouter bound confinement layer on an area enclosed by the second outerbound confinement layer, and a third inorganic layer arranged on thesecond outer bound confinement layer and the second organic layer,wherein the second organic layer has a thickness less than a thicknessof the second outer bound confinement layer.

The stacked arrangement of the plurality of package units comprises atleast one package unit;

the second outer bound confinement layer is formed with a processsimilar to that of the first outer bound confinement layer, the secondouter bound confinement layer being set at a location correspondingvertically to a location of the first outer bound confinement layer, thesecond outer bound confinement layer having a material and a thicknessidentical to those of the first outer bound confinement layer; and

the second organic layer is formed with a process similar to that of thefirst organic layer, the second organic layer having a material and athickness identical to those of the first organic layer.

The present invention also provides an OLED package structure, whichcomprises an OLED device, a first inorganic layer arranged on the OLEDdevice and covering the OLED device, a first outer bound confinementlayer arranged on the first inorganic layer, a first organic layerarranged on the first inorganic layer in an area enclosed by the firstouter bound confinement layer, and a second inorganic layer arranged onthe first organic layer and the first outer bound confinement layer,wherein the first organic layer has a thickness less that a thickness ofthe first outer bound confinement layer.

The first outer bound confinement layer is formed of a materialcomprising one or multiple ones of diamond-like carbon, zirconiumaluminate, graphene, silver, aluminum, aluminum nitride, and copper; andthe first outer bound confinement layer has a thickness of 0.5 μm-3 μm.

The first organic layer is formed of a material comprising one ormultiple ones of acrylic, hexamethyldisiloxane, polyacrylate,polycarbonate, and polystyrene; and the first organic layer has athickness of 0.5 μm-3 μm.

Optionally, the OLED package structure further comprises: a plurality ofpackage units arranged on the second inorganic layer in a stackedmanner, the package units each comprising a second outer boundconfinement layer, a second organic layer arranged inside the secondouter bound confinement layer and enclosed by the second outer boundconfinement layer, and a third inorganic layer arranged on the secondouter bound confinement layer and the second organic layer, wherein thesecond organic layer has a thickness less than a thickness of the secondouter bound confinement layer.

The stacked arrangement of the plurality of package units comprises atleast one package unit;

the second outer bound confinement layer is set at a location thatcorresponds vertically to a location of the first outer boundconfinement layer, the second outer bound confinement layer having amaterial and a thickness identical to those of the first outer boundconfinement layer; and

the second organic layer has a material and a thickness identical tothose of the first organic layer.

The present invention further provide an OLED package structure, whichcomprises an OLED device, a first inorganic layer arranged on the OLEDdevice and covering the OLED device, a first outer bound confinementlayer arranged on the first inorganic layer, a first organic layerarranged on the first inorganic layer in an area enclosed by the firstouter bound confinement layer, and a second inorganic layer arranged onthe first organic layer and the first outer bound confinement layer,wherein the first organic layer has a thickness less that a thickness ofthe first outer bound confinement layer;

wherein the first outer bound confinement layer is formed of a materialcomprising one or multiple ones of diamond-like carbon, zirconiumaluminate, graphene, silver, aluminum, aluminum nitride, and copper; andthe first outer bound confinement layer has a thickness of 0.5 μm-3 μm;and

wherein the first organic layer is formed of a material comprising oneor multiple ones of acrylic, hexamethyldisiloxane, polyacrylate,polycarbonate, and polystyrene; and the first organic layer has athickness of 0.5 μm-3 μm.

The efficacy of the present invention is that the present inventionprovides an OLED packaging method, in which a first outer boundconfinement layer is first formed and then, a first organic layer isformed on the first inorganic layer in an area enclosed by the firstouter bound confinement layer so that facilities for forming the firstorganic layer can be diversified and an organic material used to formthe first organic layer is not subjected to constraint in respect ofviscosity thereof, whereby using an organic material with a reducedviscosity allows for better homogeneity of the first organic layer, thethickness reduced, and thus helping reduce a curving radius of the OLEDpackage structure to realize rollable displaying with a reduced curvingradius. Further, the first outer bound confinement layer helps blockexternal moisture and oxygen from corroding the first organic layer in asideway direction so that the OLED package structure so manufacturedexhibits better capability for blocking moisture and oxygen and extendedservice life. The present invention provides an OLED package structure,which allows for realization of rollable displaying with a reducedcurving radius and also exhibits better capability for blocking moistureand oxygen and extended service life.

For better understanding of the features and technical contents of thepresent invention, reference will be made to the following detaileddescription of the present invention and the attached drawings. However,the drawings are provided only for reference and illustration and arenot intended to limit the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS

The technical solution, as well as other beneficial advantages, of thepresent invention will become apparent from the following detaileddescription of embodiments of the present invention, with reference tothe attached drawings.

In the drawings:

FIG. 1 is a flow chart illustrating an OLED packaging method accordingto the present invention;

FIG. 2 is a schematic view illustrating Step 1 of the OLED packagingmethod according to the present invention;

FIG. 3 is a schematic view illustrating Step 2 of the OLED packagingmethod according to the present invention;

FIG. 4 is a schematic view illustrating Step 3 of the OLED packagingmethod according to the present invention;

FIG. 5 is a schematic view illustrating Step 4 of the OLED packagingmethod according to the present invention;

FIG. 6 is a schematic view illustrating Step 5 of the OLED packagingmethod according to the present invention;

FIG. 7 is a schematic view illustrating Step 6 of the OLED packagingmethod according to the present invention;

FIG. 8 is a schematic view illustrating Step 7 of the OLED packagingmethod according to the present invention and is also a schematiccross-sectional view of a first example of an OLED package structureaccording to the present invention; and

FIG. 9 is a schematic view illustrating Step 8 of the OLED packagingmethod according to the present invention and is also a schematiccross-sectional view of a second example of an OLED package structureaccording to the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

To further expound the technical solution adopted in the presentinvention and the advantages thereof, a detailed description will begiven with reference to the preferred embodiments of the presentinvention and the drawings thereof.

Referring to FIG. 1, the present invention provides an OLED packagingmethod, which comprises the following steps:

Step 1: as shown in FIG. 2, providing an OLED device 10 and forming afirst inorganic layer 20 on the OLED device 10 such that the firstinorganic layer 20 covers the OLED device 10.

Specifically, in Step 1, plasma enhanced chemical vapor deposition,atomic layer deposition, pulsed laser deposition, sputtering, or vapordeposition is applied to form the first inorganic layer 20.

Specifically, the first inorganic layer 20 is formed of a materialcomprising one or multiple ones of aluminum oxide (Al₂O₃), zinc peroxide(ZnO₂), titanium dioxide (TiO₂), silicon nitride (SiN_(x)), siliconcarbonitride (SiCN_(x)), silicon oxide (SiO_(x)), zirconium oxide(ZrO₂), and aluminum nitride (AlN); and the first inorganic layer 20 hasa thickness of 0.5 μm-1 μm. The first inorganic layer 20 functions toblock moisture and oxygen from corroding the OLED device 10.

Step 2: as shown in FIG. 3, forming an organic photoresist layer 30 onthe first inorganic layer 20.

Specifically, in Step 2, spin coating, screen printing, slot coating,dispensing, or ink jet printing is applied to form the organicphotoresist layer 30.

Specifically, the organic photoresist layer 30 is formed of a materialcomprising negative organic photoresist; and the organic photoresistlayer 30 has a thickness of 0.5 μm-3 μm. The thickness of the organicphotoresist layer 30 constrains a thickness range of a first outer boundconfinement layer 45 that is formed subsequently.

Step 3: as shown in FIG. 4, using a mask 31 to subject the organicphotoresist layer 30 to exposure and development such that a developedand removed portion of the organic photoresist layer 30 defines an outerbound confinement area 21 on the first inorganic layer 20.

Step 4: as shown in FIG. 5, depositing a dense material layer 40 on theorganic photoresist layer 30 and the outer bound confinement area 21 ofthe first inorganic layer 20, such that the dense material layer 40 hasa thickness less than a thickness of the organic photoresist layer 30 toform a substrate-to-be-peeled-off 50.

Specifically, in Step 4, plasma enhanced chemical vapor deposition,atomic layer deposition, pulsed laser deposition, sputtering, or vapordeposition is applied to deposit the dense material layer 40.

Specifically, the dense material layer 40 is formed of a materialcomprising one or multiple ones of diamond-like carbon (DLC), zirconiumaluminate (ZrAl_(x)O_(y)), graphene, silver, aluminum, aluminum nitride,and copper; and the dense material layer 40 has a thickness of 0.5 μm-3μm.

Step 5: as shown in FIG. 6, dipping the substrate-to-be-peeled-off 50,in the entirety thereof, in a photoresist peeling solution so as toremove the organic photoresist layer 30 and at the same time peel off aportion of the dense material layer 40 that is located on the organicphotoresist layer 30 in combination with the organic photoresist layer30, while preserving a portion of the dense material layer 40 that islocated on the outer bound confinement area 21 of the first inorganiclayer 20 to form a first outer bound confinement layer 45.

Specifically, in Step 5, selectivity for selection of the photoresistpeeling solution is such that peeling of the organic photoresist layer30 can be achieved, while no damage may be caused on the first inorganiclayer 20 and the OLED device 10.

Specifically, the photoresist peeling solution comprises an organicsolvent.

Specifically, the first outer bound confinement layer 45 blocks externalmoisture and oxygen from corroding, in a sideway direction, a firstorganic layer 60 that will be formed in a subsequent operation.

Step 6: as shown in FIG. 7, coating an organic material on an area ofthe first inorganic layer 20 that is enclosed by the first outer boundconfinement layer 45 such that the organic material so coated has athickness less than a thickness of the first outer bound confinementlayer 45 so as to form a first organic layer 60.

Specifically, in Step 6, spin coating, screen printing, slot spincoating, dispensing, or ink jet printing is applied to form the firstorganic layer 60. Since the thickness of the organic material so coatedis less than the thickness of the first outer bound confinement layer45, overflow can be prevented.

In the above Step 2 to Step 6, the present invention first forms thefirst outer bound confinement layer 45 and then forms the first organiclayer 60 in the area of the first inorganic layer 20 that is enclosed bythe first outer bound confinement layer 45. This provides advantages,such as (1) the coating operation of the organic material cab beperformed with more diverse facilities; (2) the organic material usedcan be of a smaller viscosity and the smaller viscosity of the organicmaterial allows for easy flowing and smooth spreading so as to achievebetter uniformity of the first organic layer 60 so formed; (3) thethickness of the first organic layer 60 can be made thinner tofacilitate realization of rollable displaying with a reduced curvingradius; and (4) the first outer bound confinement layer 45 helps blockexternal moisture and oxygen from corroding, in a sideway direction, thefirst organic layer 60.

Specifically, the first organic layer 60 is formed of a materialcomprising one or multiple ones of acrylic, hexamethyldisiloxane(HMDSO), polyacrylate, polycarbonate, and polystyrene. The first organiclayer 60 has a thickness of 0.5 μm-3 μm. The first organic layer 60provides functions for planarization and releasing stress.

Step 7: as shown in FIG. 8, forming a second inorganic layer 70 on thefirst organic layer 60 and the first outer bound confinement layer 45.

To this point, basic packaging of the OLED device 10 is completed.

Specifically, in Step 7, the second inorganic layer 70 is formed with aprocess that is similar to that of the first inorganic layer 20 and thesecond inorganic layer 70 has a material and a thickness identical tothose of the first inorganic layer 20.

Further, to enhance the effect of packaging of the OLED device 10, theOLED packaging method of the present invention may further comprises:

Step 8: as shown in FIG. 9, forming a plurality of package units 80 onthe second inorganic layer 70 in a stacked manner such that the packageunits 80 each comprise an second outer bound confinement layer 85, asecond organic layer 90 arranged inside the second outer boundconfinement layer 85 on an area enclosed by the second outer boundconfinement layer 85, and a third inorganic layer 95 arranged on thesecond outer bound confinement layer 85 and the second organic layer 90,wherein the second organic layer 90 has a thickness less than athickness of the second outer bound confinement layer 85.

Specifically, as shown in FIG. 9, the stacked arrangement of theplurality of package units 80 comprises at least one package unit 80.

Specifically, the second outer bound confinement layer 85 is formed witha process similar to that of the first outer bound confinement layer 45and the second outer bound confinement layer 85 is set at a locationthat corresponds vertically to a location of the first outer boundconfinement layer 45 and the second outer bound confinement layer 85 hasa material and a thickness identical to those of the first outer boundconfinement layer 45.

Specifically, the second organic layer 90 is formed with a processsimilar to that of the first organic layer 60 and the second organiclayer 90 has a material and a thickness identical to those of the firstorganic layer 60.

Specifically, the third inorganic layer 95 is formed with a processsimilar to that of the second inorganic layer 70 and the third inorganiclayer 95 has a material and a thickness identical to those of the secondinorganic layer 70.

In the above-described OLED packaging method, a first outer boundconfinement layer 45 is first formed and then, a first organic layer 60is formed on the first inorganic layer 20 in an area enclosed by thefirst outer bound confinement layer 45 so that facilities for formingthe first organic layer 60 can be diversified and an organic materialused to form the first organic layer 60 is not subjected to constraintin respect of viscosity thereof, whereby using an organic material witha reduced viscosity allows for better homogeneity of the first organiclayer 60, the thickness reduced, and thus helping reduce a curvingradius of the OLED package structure to realize rollable displaying witha reduced curving radius. Further, the first outer bound confinementlayer 45 helps block external moisture and oxygen from corroding thefirst organic layer 60 in a sideway direction so that the OLED packagestructure so manufactured exhibits better capability for blockingmoisture and oxygen and extended service life.

Referring to FIG. 8, based on the above-described OLED packaging method,the present invention also provides an OLED package structure, whichcomprises an OLED device 10, a first inorganic layer 20 arranged on theOLED device 10 and covering the OLED device 10, a first outer boundconfinement layer 45 arranged on the first inorganic layer 20, a firstorganic layer 60 arranged on the first inorganic layer 20 in an areaenclosed by the first outer bound confinement layer 45, and a secondinorganic layer 70 arranged on the first organic layer 60 and the firstouter bound confinement layer 45, wherein the first organic layer 60 hasa thickness less that a thickness of the first outer bound confinementlayer 45.

Specifically, the first inorganic layer 20 is formed of a materialcomprising one or multiple ones of aluminum oxide (Al₂O₃), zinc peroxide(ZnO₂), titanium dioxide (TiO₂), silicon nitride (SiN_(x)), siliconcarbonitride (SiCN_(x)), silicon oxide (SiO_(x)), zirconium oxide(ZrO₂), and aluminum nitride (AlN); and the first inorganic layer 20 hasa thickness of 0.5 μm-1 μm.

Specifically, the first outer bound confinement layer 45 is formed of amaterial comprising one or multiple ones of diamond-like carbon (DLC),zirconium aluminate (ZrAl_(x)O_(y)), graphene, silver, aluminum,aluminum nitride, and copper; and the first outer bound confinementlayer 45 has a thickness of 0.5 μm-3 μm.

Specifically, the first organic layer 60 is formed of a materialcomprising one or multiple ones of acrylic, hexamethyldisiloxane(HMDSO), polyacrylate, polycarbonate, and polystyrene. The first organiclayer 60 has a thickness of 0.5 μm-3 μm.

Specifically, the second inorganic layer 70 has a material and athickness identical to those of the first inorganic layer 20.

Further, referring to FIG. 9, the OLED package structure of the presentinvention may further comprises: a plurality of package units 80arranged on the second inorganic layer 70 in a stacked manner. Thepackage units 80 each comprises a second outer bound confinement layer85, a second organic layer 90 arranged inside the second outer boundconfinement layer 85 and enclosed by the second outer bound confinementlayer 85, and a third inorganic layer 95 arranged on the second outerbound confinement layer 85 and the second organic layer 90, wherein thesecond organic layer 90 has a thickness less than a thickness of thesecond outer bound confinement layer 85.

Specifically, as shown in FIG. 9, the stacked arrangement of theplurality of package units 80 comprises at least one package unit 80.

Specifically, the second outer bound confinement layer 85 is set at alocation that corresponds vertically to a location of the first outerbound confinement layer 45 and the second outer bound confinement layer85 has a material and a thickness identical to those of the first outerbound confinement layer 45.

Specifically, the second organic layer 90 has a material and a thicknessidentical to those of the first organic layer 60.

Specifically, the third inorganic layer 95 has a material and athickness identical to those of the second inorganic layer 70.

In the above-described OLED package structure, a first outer boundconfinement layer 45 is first formed and then, a first organic layer 60is formed on the first inorganic layer 20 in an area enclosed by thefirst outer bound confinement layer 45 so that facilities for formingthe first organic layer 60 can be diversified and an organic materialused to form the first organic layer 60 is not subjected to constraintin respect of viscosity thereof, whereby using an organic material witha reduced viscosity allows for better homogeneity of the first organiclayer 60, the thickness reduced, and thus helping reduce a curvingradius of the OLED package structure to realize rollable displaying witha reduced curving radius. Further, the first outer bound confinementlayer 45 helps block external moisture and oxygen from corroding thefirst organic layer 60 in a sideway direction so that the OLED packagestructure so manufactured exhibits better capability for blockingmoisture and oxygen and extended service life.

In summary, the present invention provides an OLED packaging method andan OLED package structure. The OLED packaging method according to thepresent invention is such that a first outer bound confinement layer isfirst formed and then, a first organic layer is formed on the firstinorganic layer in an area enclosed by the first outer bound confinementlayer so that facilities for forming the first organic layer can bediversified and an organic material used to form the first organic layeris not subjected to constraint in respect of viscosity thereof, wherebyusing an organic material with a reduced viscosity allows for betterhomogeneity of the first organic layer, the thickness reduced, and thushelping reduce a curving radius of the OLED package structure to realizerollable displaying with a reduced curving radius. Further, the firstouter bound confinement layer helps block external moisture and oxygenfrom corroding the first organic layer in a sideway direction so thatthe OLED package structure so manufactured exhibits better capabilityfor blocking moisture and oxygen and extended service life. The OLEDpackage structure according to the present invention allows forrealization of rollable displaying with a reduced curving radius andalso exhibits better capability for blocking moisture and oxygen andextended service life.

Based on the description given above, those having ordinary skills inthe art may easily contemplate various changes and modifications of hetechnical solution and the technical ideas of the present invention. Allthese changes and modifications are considered belonging to theprotection scope of the present invention as defined in the appendedclaims.

What is claimed is:
 1. An organic light emitting display (OLED)packaging method, comprising the following steps: Step 1: providing aOLED device and forming a first inorganic layer on the OLED device suchthat the first inorganic layer covers the OLED device; Step 2: formingan organic photoresist layer on the first inorganic layer; Step 3:subjecting the organic photoresist layer to exposure and developmentsuch that a developed and removed portion of the organic photoresistlayer defines an outer bound confinement area on the first inorganiclayer; Step 4: depositing a dense material layer on the organicphotoresist layer and the outer bound confinement area of the firstinorganic layer, such that the dense material layer has a thickness lessthan a thickness of the organic photoresist layer to form asubstrate-to-be-peeled-off; Step 5: dipping thesubstrate-to-be-peeled-off, in the entirety thereof, in a photoresistpeeling solution so as to remove the organic photoresist layer and atthe same time peel off a portion of the dense material layer that islocated on the organic photoresist layer in combination with the organicphotoresist layer, while preserving a portion of the dense materiallayer that is located on the outer bound confinement area of the firstinorganic layer to form a first outer bound confinement layer; Step 6:coating an organic material on an area of the first inorganic layer thatis enclosed by the first outer bound confinement layer such that theorganic material so coated has a thickness less than a thickness of thefirst outer bound confinement layer so as to form a first organic layer;and Step 7: forming a second inorganic layer on the first organic layerand the first outer bound confinement layer.
 2. The OLED packagingmethod as claimed in claim 1, wherein in Step 4, plasma enhancedchemical vapor deposition, atomic layer deposition, pulsed laserdeposition, sputtering, or vapor deposition is applied to deposit thedense material layer; the dense material layer is formed of a materialcomprising one or multiple ones of diamond-like carbon, zirconiumaluminate, graphene, silver, aluminum, aluminum nitride, and copper; andthe dense material layer has a thickness of 0.5 μm-3 μm.
 3. The OLEDpackaging method as claimed in claim 1, wherein in Step 6, spin coating,screen printing, slot spin coating, dispensing, or ink jet printing isapplied to form the first organic layer; the first organic layer isformed of a material comprising one or multiple ones of acrylic,hexamethyldisiloxane, polyacrylate, polycarbonate, and polystyrene; andthe first organic layer has a thickness of 0.5 μm-3 μm.
 4. The OLEDpackaging method as claimed in claim 1 further comprising Step 8:forming a plurality of package units on the second inorganic layer in astacked manner such that the package units each comprise an second outerbound confinement layer, a second organic layer arranged inside thesecond outer bound confinement layer on an area enclosed by the secondouter bound confinement layer, and a third inorganic layer arranged onthe second outer bound confinement layer and the second organic layer,wherein the second organic layer has a thickness less than a thicknessof the second outer bound confinement layer.
 5. The OLED packagingmethod as claimed in claim 4, wherein the stacked arrangement of theplurality of package units comprises at least one package unit; thesecond outer bound confinement layer is formed with a process similar tothat of the first outer bound confinement layer, the second outer boundconfinement layer being set at a location corresponding vertically to alocation of the first outer bound confinement layer, the second outerbound confinement layer having a material and a thickness identical tothose of the first outer bound confinement layer; and the second organiclayer is formed with a process similar to that of the first organiclayer, the second organic layer having a material and a thicknessidentical to those of the first organic layer.